Location of the position of IC on the PCB there are two, namely mobile phone IC in glue (resin) and ic laid without glue. for the removal of IC that are not glued together we have learned and this time we will learn how to lifting the glued IC. A lot of mistakes made when moving or lifting the IC is in the rapture glued and glued IC which has a substantial risk that could damage broken lines or damage to the phone PCB, risks taken in doing this component is big enough, just imagine if you have no charging damage on your mobile phone, having analyzed the damage caused by IC UEM (Universal Energy Management) and the chip was glued or protected by a resin, the removal of the one on the chip can cause further damage that could occur total dead cell phone. Surely you do not want your phone to be victims, Well this is the risk that must be taken by a technician, because it confirms to the customer is required before doing repair mobile phone.
IC is glued not to hard to be demolished or removed, but to preserve it for IC chip holder can be water resistant, impact resistant hard and not easily dislodged or tenuous that may cause damage. For mobile users actually an additional advantage provided by a product but still has a weakness that is if there is damage to the chip will be replaced, have a risk of more fatal. Substances used for adhesive glue it is like silicone or solid resin which is heated instead of melting it becomes 'brittle' and strong glue to be appointed. Generally, IC is given if we remove this adhesive from the PCB, the chip will be damaged, due to excessive heating to release the glue.
Another reason the process of appointment of glued UEM:
1 - Entrance of water that can damage the UEM
2 - Burned or shorting due to the high voltage of charge process
30-30 seconds autoshut Off usually after repair imei
4 - Insert sim card (insert sim card), although the sim card has been installed and others
Replacing Glued UEM IC or chip in the glue is rather difficult and requires full concentration. One cause of difficulty in removal of the glued IC is the use of nonstandard equipment in repair action. Please note the appointment of a standard instrument for investments needed funds BGA chips around $ 15.000 to 75.000, and certainly not the answer to a cheap and good. When we recall the saying goes there is no cane so the technician was trying to resolve this matter in another way that is still using steam solder for appointment.
Tools - tools that are prepared:
1. solder steam
2. siongka paste or flux
3. knife cutter (normally used scalpels that have eyes and the eyes of a flat taper)
4. tweezers
5. clip board (clipboard)
methods:
1. Use a hot soldering temperature steam with 350-400 ˚ C in air pressure from 2.5 to 3 or depending on the blower that you use.
2. Place the PCB for mobile phones on the clipboard during the work process does not shift or rock.
3. Use a good flux and place on top area and the ball - tin ball IC. flux function is to reduce damage to the PCB.
Use a knife with a pointed tip on the side of the function Ic for prying and lifting ic of the PCB. The appointment requires full concentration so as not to damage the many paths and the possibility to fly or missing other supporting components.
Warming temperatures are to remove the remaining glue or resin requires patience and it takes about 2-5 minutes, so just lift the chip confiscating waktu.jangan before certain liquid tin has been uneven, usually can be seen through the release of some tin of chips due to heat stress given.
Once lifted, the IC can be seen the remnants of glue which is located on the pcb, during the process of appointment of a better rest - the residual glue stick to the IC, so no need to clean up the remaining glue and just replace it with a new Ic.
Clean the rest - the remaining glue with a knife that has a flat tip eye. Work process is accompanied by the use of solder steam with low air pressure, using the fluxes and done gradually to avoid a break point on the PCB. The direction of the blade direction and not try random - messy.
After missing the remaining glue on the PCB PCB wait until cool and then clean the PCB by using liquid IPA (Iso propanol Alcohol). For PCB cleaner and easy to put the chip back.
Source : Cirebon Phone
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